Product Description:
In the pursuit of efficient heat dissipation solutions, our ceramic heat sink stands out and becomes the ideal choice for numerous industries. This meticulously crafted heat sink combines advanced material technology and innovative design to provide your equipment with excellent heat dissipation performance.
Exceptional Ceramic Material
Our heat sink is made of high - quality ceramic material. This material has an extremely high thermal conductivity, which can quickly conduct heat away from the heat source. Compared with traditional metal heat sinks, ceramic heat sinks are not inferior in terms of thermal conductivity efficiency. Even under certain specific working conditions, they perform more outstandingly. At the same time, ceramic materials have excellent high - temperature resistance. Even when working in a high - temperature environment for a long time, they can still maintain stable physical and chemical properties. They will not deform or age due to excessive temperature, ensuring the long - term reliability of the heat sink.
Efficient Heat Dissipation Structure Design
The unique fin structure is a major highlight of this ceramic heat sink. The carefully designed fin shape and arrangement greatly increase the contact area between the heat sink and the air, promoting the rapid dissipation of heat. Through the optimized air duct design, air can flow smoothly through the fins, taking away heat and forming efficient convective heat dissipation. In addition, the overall structure of the heat sink is compact, achieving maximum heat dissipation in a limited space, which is very suitable for application scenarios with strict space requirements.
Wide Range of Application Fields
With its excellent performance, this ceramic heat sink shows strong applicability in multiple fields. In the field of electronic devices, such as the heat dissipation of computer CPUs and GPUs, it can effectively reduce the chip temperature, improve the operating stability and performance of the device, and extend the service life of the device. In the automotive electronic system, it can be used for the heat dissipation of components such as engine control units and power modules, ensuring the reliable operation of automotive electronic devices under complex working conditions. In the LED lighting field, it can quickly dissipate the heat generated by LED chips, improve the luminous efficiency and lifespan of LED lights, and reduce the phenomenon of light decay.
Quality and Reliability Assurance
We strictly control product quality. Every link from raw material procurement to production and processing follows international standards and strict quality inspection procedures. Each ceramic heat sink has undergone strict performance tests before leaving the factory to ensure that its heat dissipation performance, structural strength and other indicators meet high - quality requirements. Choosing our ceramic heat sink means choosing a reliable heat dissipation solution to escort the stable operation of your equipment.
If you are looking for a high - performance and highly reliable heat dissipation product, our ceramic heat sink is undoubtedly your best choice. It will create a cool and stable operating environment for your equipment with its excellent heat dissipation performance.
Features:
- Product Name: Ceramic Heat Sink
- Temperature Resistance: ＜700℃
- Surface Roughness: 0.3-0.8 Um
- Density: 3.7g/cm^3
- Material: Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃
- Mechanical Strength: ≥3000MPa
- Low cost
- Not affected by humidity and dust
- No antennae effect
Technical Parameters:
| Surface Roughness |
0.3-0.8 Um |
| Insulation Strength |
>=15KV/mm |
| Durability |
Long-lasting |
| Material |
Ceramic, SiC, Al₂O₃, SiO₂, Al₄C₃ |
| Density |
3.7g/cm³ |
| Thermal Conductivity |
9-180 MW/m.K |
| Color |
Green, Black, White, Gray |
| Mechanical Strength |
>=3000MPa |
| Heat Dissipation |
Efficient |
| Size |
Various Sizes Available |
| Adhesive Tape |
With and without thermally conductive Silicone adhesive tape |
| EMI Issues |
No Electromagnetic Interference (EMI) issues |
| Antennae Effect |
No antennae effect |
Applications:
The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink has a large surface area compared to Aluminium Heat Sinks, resulting in better heat dissipation. Its lightweight design makes it easy to install and handle. With a temperature resistance of less than 700℃ and a density of 3.7g/cm^3, this product is ideal for applications that require high-temperature resistance and high-density power.
This product can be used with various electronic devices such as Transistors, MOSFETs, Schottky Diodes, IGBTs, high-density switching power supplies, high-frequency communication signal equipment, high-frequency welding machines, and other electronic devices. Its power dissipation of up to 10W makes it suitable for high-performance applications.
At Race, we offer packaging options as per customer requirements and a delivery time of 7-15 days. Payment terms are 30% TT in advance, and the balance payment is paid before shipment. The Ceramic Heat Sink/Ceramic Micro Porous Heat Sink is available in green, black, white, and gray colors, giving our customers the opportunity to choose the color that best suits their device.
